TLV277xEP, TLV277xAEP

FAMILY OF 2.7V HIGHSLEW RATE RAILTORAIL OUTPUT

OPERATIONAL AMPLIFIERS WITH SHUTDOWN

SGLS317A − OCTOBER 2005 − REVISED SEPTEMBER 2007

2

POST OFFICE BOX 655303

SELECTION OF SINGLE-SUPPLY OPERATIONAL AMPLIFIER PRODUCTS†

DEVICE

VDD

(V)

BW

(MHz)

SLEW RATE

(V/

µs)

IDD (per channel)

(

µA)

RAIL-TO-RAIL

TLV277X

2.5 to 6

5.1

10.5

1000

O

TLV247X

2.7 to 6

2.8

1.5

600

I/O

TLV245X

2.7 to 6

0.22

0.11

23

I/O

TLV246X

2.7 to 6

6.4

1.6

550

I/O

† All specifications measured at 5 V.

TA

VIOMAX

AT 25

°C

(mV)

PACKAGE‡

ORDERABLE

PART NUMBER

TOP SIDE

MARKING

2.5

SOIC (D)

Tape and reel

TLV2770MDREP§

1.6

SOIC (D)

Tape and reel

TLV2770AMDREP§

2.5

SOIC (D)

Tape and reel

TLV2771MDREP§

1.6

SOIC (D)

Tape and reel

TLV2771AMDREP§

2.5

SOIC (D)

Tape and reel

TLV2772MDREP§

2.5

TSSOP (PW)

Tape and reel

TLV2772MPWREP§

1.6

SOIC (D)

Tape and reel

TLV2772AMDREP

2772AE

1.6

TSSOP (PW)

Tape and reel

TLV2772AMPWREP§

−55

°C to 125°C

2.5

SOIC (D)

Tape and reel

TLV2773MDREP§

−55

°C to 125°C

1.6

SOIC (D)

Tape and reel

TLV2773AMDREP§

2.7

SOIC (D)

Tape and reel

TLV2774MDREP

2774EP

2.7

TSSOP (PW)

Tape and reel

TLV2774MPWREP§

2.1

SOIC (D)

Tape and reel

TLV2774AMDREP

2774AEP

2.1

TSSOP (PW)

Tape and reel

TLV2774AMPWREP§

2.7

SOIC (D)

Tape and reel

TLV2775MDREP§

2.7

TSSOP(PW)

Tape and reel

TLV2775MPWREP§

2.1

SOIC (D)

Tape and reel

TLV2775AMDREP§

2.1

TSSOP (PW)

Tape and reel

TLV2775AMPWREP§

† For the most current package and ordering information, see the Package Option Addendum at the end of this document,

or see the TI website at www.ti.com.

‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available

at www.ti.com/packaging.

§ Product Preview