ESK datasheet(25/66 Pages) KEMET

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Ceramic Capacitors

Military Grade Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) (cont.)

MIL-PRF-123 • High Reliability • BR (X7R) & BX (X7R) Dielectrics • 6.3VDC–200VDC

(Military Grade & Space Quality)

DSCC Approved • High Reliability • BP (C0G/NP0), BR (X7R) & BX (X7R) Dielectrics • 6.3VDC–200VDC

(Military Grade)

Size Code

EIA

Style

Dielectric

Capacitance

Range

Voltage

Range (VDC)

Benefits

0805

CKS51

BP, BX

1.0pF - 0.018µF

50 - 100

-55°C to +125°C operating temperature range

High reliability

Non-polar device, minimizing installation concerns

Tin coated (Sn60) end metallization option available

SnPb plated (0/30) end metallization option available

Gold plated end metallization option available

•

1206

CKS55

BP, BX

1.0pF - 0.039µF

50 - 100

1210

CKS52

BP, BX

300pF - 0.1µF

50 - 100

1808

CKS53

BP, BX

300pF - 0.1µF

50 - 100

1812

CKS56

BP, BX

1200pF - 0.18µF

50 - 100

1825

CKS5

BP, BX

3900pF - 0.4µF

50 - 100

2225

CKS54

1100pF - 1.0µF

Size Code

EIA

Style

Dielectric

Capacitance

Range

Voltage

Range (VDC)

Benefits

0402

DSCC 03029

BR, BX

100pF - 2200pF

6.3 - 200

Defense Supply Center, Columbus approved

Federal Stock Control Number, Cage Code 31433

Meets US Department of Defense (USDoD) specifications

per MIL-PRF-55681

Meets USDoD standards per MIL-STD-202 & MIL-STD-1285

High reliability

Non-polar device, minimizing installation concerns

•

0603

DSCC 03028

BR, BX

100pF - 0.1µF

6.3 - 200

0805

DSCC 05006 BP, BR, BX 1.0pF - 0.018µF

10 - 200

1206

DSCC 0500 BP, BR, BX 1.0pF - 0.04µF

10 - 200

2220

DSCC 91019

0.56µF - 1.0µF

25 - 50

Military Grade Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial-Off-The-Shelf (COTS) for Higher Reliability Applications • X7R and C0G Dielectrics • 6.3VDC–250VDC

(COTS • MIL Screened)

Size Code

EIA/Metric

Dimensions

L x W (mm)

Dielectric/

Capacitance Range

Voltage

Range (VDC)

Benefits

0402/1005

1.0 x 0.5

C0G – 0.5pF - 2200pF

XR – 150pF - 0.1µF

10 - 100

6.3 - 50

-55°C to +125°C operating temperature range

Voltage conditioning and post-electrical testing per

MIL-PRF-55681, Paragraph 4.8.3.1

Destructive Physical Analysis (DPA) per EIA-469

Humidity, steady state, low voltage (85/85) per MIL-STD

202, Method 103, Condition A

Certificate of compliance

RoHS-compliant (excluding SnPb end

metallization option)

Non-polar device, minimizing installation concerns

100% pure matte tin plated end metallization allowing for

excellent solderability

SnPb plated end metallization option available upon request

(5% min)

•

0603/1608

1.6 x 0.8

C0G – 0.5pF - 0.015µF

XR – 180pF - 0.4µF

10 - 200

6.3 - 200

0805/2012

2.0 x 1.25

C0G – 0.5pF - 0.04µF

XR – 180pF - 2.2µF

10 - 200

6.3 - 250

1206/3216

3.2 x 1.6

C0G – 10pF - 0.1µF

XR – 1000pF - 10µF

10 - 200

6.3 - 250

1210/3225

3.2 x 2.5

C0G – 10pF - 0.022µF

XR – 2200pF - 22µF

10 - 200

6.3 - 250

1808/4520

4.5 x 3.2

XR – 400pF - 0.18µF

50 - 200

1812/4532

4.5 x 3.2

C0G – 40pF - 0.22µF

XR – 6800pF - 10µF

50 - 200

25 - 250

1825/4564

4.5 x 6.4

C0G – 3900pF - 0.02µF

XR – 0.022µF - 2.2µF

50 - 200

25 - 250

2220/5650

5.6 x 5.0

C0G – 6800pF - 0.4µF

XR – 0.82µF - 22µF

50 - 200

25 - 250

2225/5664

5.6 x 6.3

C0G – 400pF - 0.033µF

XR – 0.04µF - 2.2µF

50 - 200

50 - 250

ESK Datasheet(PDF) 25 Page - Kemet Corporation

ESK Datasheet(HTML) 25 Page - Kemet Corporation

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