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1N5822U Datasheet(PDF) 6 Page - STMicroelectronics |
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1N5822U Datasheet(HTML) 6 Page - STMicroelectronics |
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6 / 7 page  Ordering information 1N5822U 6/7 Doc ID 16007 Rev 2 3 Ordering information 4 Revision history Table 7. Ordering information(1) 1. Contact ST sales office for information about the specific conditions for products in die form and gold plated versions. Order code ESCC detailed specification Package Lead finish Marking EPPL Weight Packing 1N5822UB1 - LCC2B Gold plated 22UB1 - 0.18 g Waffle pack 1N5822U02B 5106/020/02 Solder dip 22U02B Y Table 8. Document revision history Date Revision Changes 10-Aug-2009 1 First issue. 23-Sep-2011 2 Updated Table 1 and Table 7 for ESCC qualification. |
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