Characteristics

STPS5L60-Y

4/7

Doc ID 022951 Rev 1

Figure 11.

Thermal resistance junction to ambient versus copper surface under each lead

(epoxy printed board FR4, copper thickness = 35 µm)

Figure 7.

Reverse leakage current versus

reverse voltage applied (typical

values)

Figure 8.

Junction capacitance versus

reverse voltage applied (typical

values)

Figure 9.

Forward voltage drop versus

forward current (low level)

Figure 10.

Forward voltage drop versus

forward current (high level)

IR(mA)

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

0

5

10

15

20

25

30

35

40

45

50

55

60

Tj=150°C

Tj=125°C

Tj=25°C

Tj=100°C

Tj=75°C

Tj=50°C

VR(V)

C(pF)

100

1000

1

10

100

F=1MHz

Vosc=30mV

Tj=25°C

VR(V)

IFM(A)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0.00

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.40

0.45

0.50

0.55

0.60

Tj=25°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Typical values)

Tj=125°C

(Typical values)

VFM(V)

IFM(A)

0

5

10

15

20

25

30

35

40

45

50

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

Tj=25°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Typical values)

Tj=125°C

(Typical values)

VFM(V)

R

(°C/W)

th(j-a)

0

10

20

30

40

50

60

70

80

90

100

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SMC

S

(cm²)

CU