AMC1204

AMC1204B

SBAS512C – APRIL 2011 – REVISED AUGUST 2012

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE/ORDERING INFORMATION

For the most current package and ordering information see the Package Option Addendum at the end of this

document, or visit the device product folder on www.ti.com.

FAMILY OVERVIEW

MODULATOR

DIGITAL

GAIN ERROR

PART NUMBER

CLOCK (MHz)

SUPPLY

CLOCK SOURCE

INL (LSB)

(%)

THD (dB)

AMC1203

10

5V

Internal

±9

±2

–84.5

AMC1203B

10

5V

Internal

±6

±1

–88

AMC1204

20

3V, 3.3V, or 5V

External

±8

±2

–80

AMC1204B

20

3V, 3.3V, or 5V

External

±8

±2

–80

ABSOLUTE MAXIMUM RATINGS

(1)

Over the operating ambient temperature range, unless otherwise noted.

AMC1204, AMC1204B

PARAMETER

MIN

MAX

UNIT

Supply voltage, AVDD to AGND or DVDD to DGND

–0.3

+6

V

Analog input voltage at VINP, VINN

AGND – 0.5

AVDD + 0.5

V

Digital input voltage at CLKIN

DGND – 0.3

DVDD + 0.3

V

Input current to any pin except supply pins

–10

+10

mA

+150

°C

–40

+125

°C

Human body model (HBM)

–3000

+3000

V

JEDEC standard 22, test method A114-C.01

Electrostatic discharge (ESD),

Charged device model (CDM)

–1500

+1500

V

all pins

JEDEC standard 22, test method C101

Machine model (MM)

–200

+200

V

JEDEC standard 22, test method A115A

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics

is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.

THERMAL INFORMATION

AMC1204,

AMC1204B

UNITS

DW

16 PINS

Junction-to-ambient thermal resistance

78.5

Junction-to-case (top) thermal resistance

41.3

Junction-to-board thermal resistance

50.2

°C/W

Junction-to-top characterization parameter

11.5

Junction-to-board characterization parameter

41.2

Junction-to-case (bottom) thermal resistance

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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