RT8293A datasheet(13/15 Pages) RICHTEK

13 / 15 page

RT8293A

DS8293A-03 March 2011

www.richtek.com

(d) Copper Area = 50mm

2 ,

θJA = 51°C/W

(e) Copper Area = 70mm

2 ,

θJA = 49°C/W

Figure 6. Themal Resistance vs. Copper Area Layout

Design

Layout Consideration

Follow the PCB layout guidelines for optimal performance

of the RT8293A.

}

Keep the traces of the main current paths as short and

wide as possible.

}

Put the input capacitor as close as possible to the device

pins (VIN and GND).

}

SW node is with high frequency voltage swing and should

be kept at small area. Keep analog components away

from the SW node to prevent stray capacitive noise pick-

up.

}

Connect feedback network behind the output capacitors.

Keep the loop area small. Place the f eedback

components near the RT8293A.

}

Connect all analog grounds to a command node and

then connect the command node to the power ground

behind the output capacitors.

}

An example of PCB layout guide is shown in Figure 8 for

reference.

Figure 8. PCB Layout Guide

VIN

VOUT

GND

CIN

GND

VOUT

COUT

Input capacitor must

be placed as close

to the IC as possible.

SW should be connected to inductor by

wide and short trace. Keep sensitive

components away from this trace.

The feedback components

must be connected as close

to the device as possible.

BOOT

VIN

GND

COMP

GND

RS*

CS*

GND

VIN

REN

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