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RT9012-FMPQV Datasheet(PDF) 10 Page - Richtek Technology Corporation |
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RT9012-FMPQV Datasheet(HTML) 10 Page - Richtek Technology Corporation |
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10 / 11 page ![]() RT9012 10 DS9012-09 April 2011 www.richtek.com For recommended operating conditions specification of RT9012, the maximum junction temperature is 125 °C. The junction to ambient thermal resistance ( θJA is layout dependent) for WDFN-8L 2x2 package is 108 °C/W on the standard JEDEC 51-3 single-layer thermal test board. The maximum power dissipation at TA= 25 °C can be calculated by following formula : PD(MAX) = ( 125 °C − 25°C ) / 108 = 0.926W for WDFN-8L 2x2 packages The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA . For RT9012 packages, the Figure 3 of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power allowed. Figure 3. Derating Curves for RT9012 Packages 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 25 50 75 100 125 Ambient Temperature ( °C) WDFN-8L 2x2 |
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