LP5907

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SNVS798D – APRIL 2012 – REVISED NOVEMBER 2012

ABSOLUTE MAXIMUM RATINGS

(1) (2) (3)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input voltage

–0.3

6

V

Output voltage

6

V

Enable input voltage

6

V

Internally Limited

150

°C

Storage temperature range

–65

150

°C

Maximum lead temperature (soldering, 10 seconds)

260

°C

Human body model

2

kV

Machine model

200

V

(1)

If Military or Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability

and specifications.

(2)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics tables.

(3)

Internal thermal shutdown circuitry protects the device from permanent damage.

(4)

The Human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. The machine model is a 200 pF

capacitor discharged directly into each pin. MIL-STD-883 3015.7

OPERATING RATINGS

(1) (2)

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage range

2.2

5.5

V

Enable voltage range

5.5

V

0

250

mA

Junction temperature range

–40

+125

°C

–40

+85

°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

part/package in the application (

THERMAL CHARACTERISTICS

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Micro SMD

119.6

Junction to ambient thermal

SOT23

188.8

°C/W

4L cellphone board (micro SMD)

186.5

(1)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

(2)

Detailed description of the board can be found in JESD51-7

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