ACT4070B

Rev 0, 23-Apr-12

Innovative Power

TM

- 2 -

www.active-semi.com

Copyright © 2012 Active-Semi, Inc.

ORDERING INFORMATION

PART NUMBER

TEMPERATURE RANGE

PACKAGE

PINS

PACKING

ACT4070BYH

-40°C to 85°C

SOP-8/EP

8

TUBE

ACT4070BYH-T

-40°C to 85°C

SOP-8/EP

8

TAPE & REEL

PIN CONFIGURATION

PIN DESCRIPTION

PIN NUMBER

PIN NAME

PIN DESCRIPTION

1

BS

Bootstrap. This pin acts as the positive rail for the high-side switch’s gate driver.

Connect a 10nF between this pin and SW.

2

IN

Input Supply. Bypass this pin to GND with a low ESR capacitor. See Input Ca-

pacitor

in Application Information section.

3

SW

Switch Output. Connect this pin to the switching end of the inductor.

4

GND

Ground.

5

FB

Feedback Input. The voltage at this pin is regulated to 0.808V. Connect to the

resistor divider between output and ground to set output voltage.

6

COMP

Compensation Pin. See Compensation Technique in Application Information sec-

tion.

7

EN

Enable Input. When higher than 1.6V, this pin turns the IC on. When lower than

1.5V, this pin turns the IC off. This pin has a small internal pull up current to a high

level voltage when pin is not connected.

8

N/C

Not Connected.

EP

EP

Exposed Pad shown as dashed box. The exposed thermal pad should be con-

nected to board ground plane and pin 4. The ground plane should include a large

exposed copper pad under the package for thermal dissipation (see package out-

line). The leads and exposed pad should be flush with the board, without offset

from the board surface.

SOP-8/EP