H431 datasheet(5/7 Pages) HSMC

5 / 7 page

HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : IC200401

Issued Date : 2004.03.01

Revised Date : 2008.04.01

Page No. : 5/7

H431 Series

HSMC Product Specification

SOT-23 Dimension

DIM

Min.

Max.

SOT-89 Dimension

DIM

Min.

Max.

4.40

4.60

4.05

4.25

1.50

1.70

2.40

2.60

0.36

0.51

*1.50

*3.00

1.40

1.60

0.35

0.41

*: Typical, Unit: mm

Marking:

Date Code

HSMC Logo

Control Code

H4 3 1

Pb Free Mark

Pb-Free: "

. " (Note)

Normal: None

Note: Green label is used for pb-free packing

Pin Style: 1.Reference 2.Anode 3.Cathode

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

3-Lead SOT-89 Plastic

Surface Mounted Package

HSMC Package Code: M

2.80

3.04

1.20

1.60

0.89

1.30

0.30

0.50

1.70

2.30

0.013

0.10

0.085

0.177

0.32

0.67

0.85

1.15

2.10

2.75

0.25

0.65

*: Typical, Unit: mm

Marking:

Pb Free Mark

Pb-Free: " " (Note)

Normal: None

Note: Pb-free product can distinguish by the green

label or the extra description on the right

side of the label.

Pin Style: 1.Reference 2.Cathode 3.Anode

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

3-Lead SOT-23 Plastic

Surface Mounted Package

HSMC Package Code: N

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