MAX15090A datasheet(2/15 Pages) MAXIM

2 / 15 page

Maxim Integrated

MAX15090/MAX15090A

2.7V to 18V, 12A, Hot-Swap Solution

with Current Report Output

VCC to GND...........................................................-0.3V to +20V

IN to GND..............................................................-0.3V to +20V

OUT to GND...............................................-0.3V to (VIN + 0.3V)

GATE to OUT...........................................................-0.3V to +6V

CDLY, ISENSE to GND ...........................-0.3V to (VREG + 0.3V)

EN, CB, UV, OV to GND .........................................-0.3V to +6V

REG to GND............................-0.3V to min (+6V, (VCC + 0.3V))

PG, FAULT to GND ...............................................-0.3V to +20V

Continuous Power Dissipation (TA = +70NC)

WLP (derate 23.8mW/NC above +70NC) ....................1500mW

Operating Temperature Range.......................... -40NC to +85NC

Junction Temperature .....................................................+150NC

Storage Temperature Range............................ -60NC to +150NC

Lead Temperature (soldering, 10s) ................................+300NC

Soldering Temperature (reflow) ......................................+260NC

Junction-to-Ambient Thermal Resistance (

qJA) ..............42°C/W

Junction-to-Case Thermal Resistance (

qJC).....................7°C/W

ABSOLUTE MAxIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Thermal resistance can be lowered with improved board design.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PACkAGE ThERMAL ChARACTERISTICS (Note 1)

ELECTRICAL ChARACTERISTICS

(VIN = VCC = 2.7V to 18V, TA = TJ = -40°C to +85°C, unless otherwise noted. Typical values are at VIN = 12V, RCB = 33.2kω, and

TA = +25°C.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAx

UNITS

POWER SUPPLIES

VCC Operating Range

VCC

2.7

IN Operating Range

VIN

2.7

VCC Supply Current

ICC

VIN = 3V

0.5

0.75

IN Supply Current

IIN

RCB = 40.2kω, no load

5.1

6.2

RCB = 10kω, no load

1.4

1.8

VCC Default Undervoltage

Lockout

VUVLO

VCC rising

2.35

2.5

2.65

VCC Default Undervoltage-

Lockout Hysteresis

VUVLO_HYS

0.1

REG Regulator Voltage

VREG

No load, VCC > 4V

3.15

3.35

3.55

UV Turn-On Threshold

VUV_TH

VUV rising

1.21

1.23

1.25

UV Turn-On Threshold

Hysteresis

VUV_HYS

VUV falling

0.1

OV Turn-On Threshold

VOV_TH

VOV rising

1.21

1.23

1.25

OV Turn-On Threshold

Hysteresis

VOV_HYS

VOV falling

0.1

EN Threshold

VEN_TH

VEN rising

0.95

1.05

EN Threshold Hysteresis

VEN_HYS

VEN falling

0.1

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