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AD73322LAST Datasheet(PDF) 7 Page - Analog Devices

Part # AD73322LAST
Description  Low Cost, Low Power CMOS General-Purpose Dual Analog Front End
PDF  40 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD73322LAST Datasheet(HTML) 7 Page - Analog Devices

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REV. 0
AD73322L
–7–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD73322L features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
*
(TA = 25
°C unless otherwise noted)
AVDD, DVDD to GND . . . . . . . . . . . . . . . –0.3 V to +4.6 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
Digital I/O Voltage to DGND . . . –0.3 V to (DVDD + 0.3 V)
Analog I/O Voltage to AGND . . . –0.3 V to (AVDD + 0.3 V)
Operating Temperature Range
Industrial (A Version) . . . . . . . . . . . . . . .
–40
°C to +85°C
Extended (Y Version) . . . . . . . . . . . . . . . . –40
°C to +105°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . 150
°C
SOIC,
θJA Thermal Impedance . . . . . . . . . . . . . . . 71.4°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
LQFP,
θ
JA Thermal Impedance . . . . . . . . . . . . . . .
53.2
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
ORDERING GUIDE
Temperature
Package
Package
Model
Range
Descriptions
Option
AD73322LAR
–40
°C to +85°C
Wide Body SOIC
R-28
AD73322LARU
–40
°C to +85°C
Thin Shrink TSSOP
RU-28
AD73322LAST
–40
°C to +85°C
Plastic Thin Quad
ST-44A
Flatpack (LQFP)
AD73322LYR
–40
°C to +105°C Wide Body SOIC
R-28
AD73322LYRU
–40
°C to +105°C Thin Shrink TSSOP RU-28
AD73322LYST
–40
°C to +105°C Plastic Thin Quad
ST-44A
Flatpack (LQFP)
EVAL-AD73322LEB
Evaluation Board
PIN CONFIGURATIONS
28-Lead Wide Body SOIC
(R-28)
TOP VIEW
(Not to Scale)
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
AD73322L
SDO
MCLK
SCLK
RESET
DVDD
DGND
AGND2
VINP1
VFBP1
VINN1
VFBN1
AVDD2
REFCAP
REFOUT
SDOFS
SDIFS
SDI
SE
AGND1
AVDD1
VOUTP2
VFBN2
VINN2
VFBP2
VINP2
VOUTN2
VOUTP1
VOUTN1
44-Lead Plastic Thin Quad Flatpack (LQFP)
(ST-44A)
3
4
5
6
7
1
2
10
11
8
9
40 39 38
41
42
43
44
36 35 34
37
29
30
31
32
33
27
28
25
26
23
24
PIN 1
IDENTIFIER
TOP VIEW
(Not to Scale)
AD73322L
12 13 14 15 16 17 18 19 20 21 22
NC
VOUTN1
VOUTP1
NC
VOUTN2
VOUTP2
NC
REFOUT
REFCAP
AVDD2
AVDD2
AGND2
AGND2
AGND2
NC = NO CONNECT
AGND2
DGND
DGND
DVDD
AVDD1
AVDD1
AGND1
AGND1
28-Lead Thin Shrink TSSOP
(RU-28)
TOP VIEW
(Not to Scale)
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
AD73322L
SDO
MCLK
SCLK
RESET
DVDD
DGND
AGND2
VINP1
VFBP1
VINN1
VFBN1
AVDD2
REFCAP
REFOUT
SDOFS
SDIFS
SDI
SE
AGND1
AVDD1
VOUTP2
VFBN2
VINN2
VFBP2
VINP2
VOUTN2
VOUTP1
VOUTN1
TSSOP,
θ
JA Thermal Impedance . . . . . . . . . . . . . .
97.9
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.



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