The dimension in the table below provides the recommended pad layout for each MPTS0805 device

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (Tsmax to Tp) 3 ℃/second max.

Preheat :

Temperature Min (Tsmin)

Temperature Max (Tsmax)

Time (tsmin to tsmax)

150 ℃

200 ℃

60-180 seconds

Time maintained above:

217 ℃

60-150 seconds

Peak/Classification Temperature(Tp) : 260 ℃

Time within 5℃ of actual Peak :

Temperature (tp)

20-40 seconds

Ramp-Down Rate :

6 ℃/second max.

Time 25 ℃ to Peak Temperature :

8 minutes max.

Polymeric PTC

MPTS Series

Pad dimensions (millimeters)

Device

A

Nominal

B

Nominal

C

Nominal

All 0805 Series

1.20

1.00

1.50

Solder reflow



Due to “Lead Free” nature, Temperature

and Dwell time for the soldering zone is

higher than those for Non-compliant

parts. This may cause damage to other

components.



Recommended max solder paste

thickness > 0.25mm.



Devices can be cleaned using standard

methods and aqueous solvent.



Rework should utilize standard industry

practices. Theses changes should apply

to all notes for each case size.



Storage Environment : < 30ºC / 60%RH

Caution:



If reflow temperatures exceed the

recommended profile, devices may not

meet the performance requirements.



Devices are not designed to be wave

soldered to the bottom side of the board.

Rev.7