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ADP3412 Datasheet(PDF) 7 Page - Analog Devices

Part # ADP3412
Description  Dual MOSFET Driver with Bootstrapping
PDF  8 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADP3412 Datasheet(HTML) 7 Page - Analog Devices

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ADP3412
–7–
REV. 0
where fMAX is the maximum switching frequency of the control-
ler. The peak surge current rating should be checked in-circuit,
since this is dependent on the source impedance of the 5 V sup-
ply, and the ESR of CBST.
Delay Capacitor Selection
The delay capacitor, CDLY, is used to add an additional delay
when the low-side FET drive turns off and when the high-side
drive starts to turn on. The delay capacitor adds 1 ns/pF of
additional time to the 20 ns of fixed delay.
If a delay capacitor is required, look for a good quality ceramic
capacitor with an NPO or COG dielectric, or for a good quality
mica capacitor. Both types of capacitors are available in the 1 pF
to 100 pF range and have excellent temperature and leakage
characteristics.
1
2
3
4
8
7
6
5
BST
IN
DLY
VCC
DRVH
SW
PGND
DRVL
U2
ADP3412
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
VID4
VID3
VID2
VID1
VCC
REF
CS–
PWM1
VID0
COMP
FB
CT
PWM2
CS+
PWRGND
GND
U1
ADP3160
U3
ADP3412
1
2
3
4
8
7
6
5
BST
IN
DLY
VCC
DRVH
SW
PGND
DRVL
C15
C14
C13
C12
VIN
12V
VIN RTN
270 F
4
OS-CON 16V
RA
60.4k
RB
10k
COC
1.4nF
RZ
1.1k
C11 C16 C17 C18 C19 C20 C21 C22
1200 F
8
OS-CON 2.5V
11m
ESR (EACH)
VCC(CORE)
1.1V – 1.85V
53.4A
VCC(CORE)
RTN
Q3
FDB7030L
D1
MBR052LTI
Q5
2N3904
L2
600nH
L1
600nH
Q1
FDB7030L
Q2
FDB8030L
C10
1 F
D2
MBR052LTI
C7
15pF
C5
1 F
Z1
ZMM5236BCT
R5
2.4k
R8
330
C23
330pF
C22
1nF
C4
4.7 F
R6
10
C21
15nF
C26
4.7 F
C8
15pF
C6
1 F
C9
1 F
R7
20
R4
4m
C2
100pF
C1
150pF
R1
1k
Q4
FDB8030L
+
+
+
+
+
+
+
+
FROM
CPU
Figure 3. 53.4 A Intel CPU Supply Circuit
Printed Circuit Board Layout Considerations
Use the following general guidelines when designing printed
circuit boards:
1.
Trace out the high-current paths and use short, wide traces
to make these connections.
2.
Connect the PGND pin of the ADP3412 as close as pos-
sible to the source of the lower MOSFET.
3.
The VCC bypass capacitor should be located as close as
possible to VCC and PGND pins.
Typical Application Circuits
The circuit in Figure 3 shows how two drivers can be com-
bined with the ADP3160 to form a total power conversion
solution for VCC(CORE) generation in a high-current GOA com-
puter. Figure 4 gives CPU a similar application circuit for a
35 A processor.



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