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MMAS40G10D Datasheet(PDF) 1 Page - Motorola, Inc

Part # MMAS40G10D
Description  MICROMACHINED ACCELEROMETER 짹40g
PDF  4 Pages
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Manufacturer  MOTOROLA [Motorola, Inc]
Direct Link  http://www.freescale.com
Logo MOTOROLA - Motorola, Inc

MMAS40G10D Datasheet(HTML) 1 Page - Motorola, Inc

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Motorola Sensor Device Data
Micromachined Accelerometer
±40g
The MMAS40G family of silicon capacitive, micro–machined accelerometers
features integral signal amplification, signal conditioning, a 4–pole low–pass
filter and temperature compensation. Zero–G offset, full scale span and filter
roll–off are factory set and require no external passives. A calibrated self–test
feature mechanically displaces the seismic mass with the application of a digital
self–test signal.
The MMAS40G incorporates a single polysilicon seismic mass, suspended
between two fixed polysilicon plates (G–cell). The forces of acceleration move
the seismic mass, thereby resulting in a change in capacitance. The G–cell is
sealed at the wafer level, creating a particle–free environment. The G–cell
features built–in damping and over–range stops to protect it from mechanical
shock.
MMAS40G accelerometers are ideally suited for automotive crash detection
and recording, vibration monitoring, automotive suspension control, appliance
control systems, etc.
Features
• Minimum Full Scale Measurement ±40g
• Calibrated, True Self–Test
• Standard 16–Pin Plastic DIP package
• Senses Perpendicular to the Printed Circuit Board
• Integral Signal Conditioning and 4–Pole Filter
• Linear Output
• Robust, High Shock Survivability
SIMPLIFIED BLOCK DIAGRAM
g
G–CELL
4
SELF–TEST
+
+
8VS
+
A
LOW–PASS FILTER
6
BYPASS
TEMPERATURE
COMPENSATION
5
OUTPUT
7
GND
Order this document
by MMAS40G10D/D
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
PIN NUMBER (DIP)
MMAS40G10D
DIP PACKAGE
CASE 648C–03
MICROMACHINED
ACCELEROMETER
±40g
1
N/C (1)
9
N/C (1)
2
N/C (1)
10
N/C (1)
3
N/C (1)
11
N/C (1)
4
Self–Test
12
N/C (1)
5
Output
13
N/C (1)
6
Bypass (2)
14
N/C (1)
7
GND
15
N/C (1)
8VS (2)
16
N/C (1)
NOTES:
1. Internal connections. All N/C should be
tied to gnd, except pin 11 which must be
tied to pin 8.
2. Bypass to ground with 0.1
µF ceramic
capacitor for specified system perfor-
mance.
1
2 3
4 5
6 7
8
9
10
11
12
13
14
15
16
© Motorola, Inc. 1997
REV 1


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