LTC2314-14

19

231414f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

package DescripTion

1.50 – 1.75

(NOTE 4)

2.80 BSC

0.22 – 0.36

8 PLCS (NOTE 3)

DATUM ‘A’

0.09 – 0.20

(NOTE 3)

TS8 TSOT-23 0710 REV A

2.90 BSC

(NOTE 4)

0.65 BSC

1.95 BSC

0.80 – 0.90

1.00 MAX

0.01 – 0.10

0.20 BSC

0.30 – 0.50 REF

PIN ONE ID

NOTE:

1. DIMENSIONS ARE IN MILLIMETERS

2. DRAWING NOT TO SCALE

3. DIMENSIONS ARE INCLUSIVE OF PLATING

4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR

5. MOLD FLASH SHALL NOT EXCEED 0.254mm

6. JEDEC PACKAGE REFERENCE IS MO-193

3.85 MAX

0.40

MAX

0.65

REF

RECOMMENDED SOLDER PAD LAYOUT

PER IPC CALCULATOR

1.4 MIN

2.62 REF

1.22 REF

TS8 Package

8-Lead Plastic TSOT-23

(Reference LTC DWG # 05-08-1637 Rev A)