10B-2001 datasheet(2/2 Pages) AEROFLEX

2 / 2 page

APPLICATIO N NO TES

CHIP SIDE

UTP SIDE

TRANSMIT

CHANNEL

RECEIVE

CHIP SIDE

UTP SIDE

The module contains low pass filters, isolation

transformers, and common mode chokes. These

components provide impedance matching,

equipment isolation, and EMI compression to

comply with IEEE requirements. User

compliance with FCC/ CSPR class B

requirements can be achieved by applying

rigorous design guidelines to suppress noise

mechanisms. Attention to high frequency signal

paths, proper PCB grounding techniques, and

component placement is critical. Pins 5 and 12,

when grounded, provide noise return paths. At

least one of these (typically pin 12) must be

coupled with bypass capacitor. Recommended

module orientation with respect to RJ45

connector is illustrated in the application circuit.

Output pins 6 through 11 should be routed with

short, matched traces to the connector for

optimum EMI performance. The robust

mechanical package withstands IR reflow

temperatures up to 235°C. Compliant leads

provide excellent solder-joint reliability with

K.002 coplanarity. Modules are shipped in

tubes.

SCHEMATIC

TYPICAL APPLICATIO N CIRCUIT

NOT

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10B-2001 Datasheet(PDF) 2 Page - Aeroflex Circuit Technology