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MMDF2N05ZR2 Datasheet(PDF) 1 Page - Motorola, Inc |
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MMDF2N05ZR2 Datasheet(HTML) 1 Page - Motorola, Inc |
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1 / 10 page ![]() 1 Motorola TMOS Power MOSFET Transistor Device Data Designer's™ Data Sheet Medium Power Surface Mount Products TMOS Dual N-Channel with Monolithic Zener ESD Protected Gate EZFETs ™ are an advanced series of power MOSFETs which utilize Motorola’s High Cell Density TMOS process and contain monolithic back–to–back zener diodes. These zener diodes provide protection against ESD and unexpected transients. These miniature surface mount MOSFETs feature ultra low RDS(on) and true logic level performance. They are capable of withstanding high energy in the avalanche and commutation modes and the drain–to–source diode has a very low reverse recovery time. EZFET devices are designed for use in low voltage, high speed switching applications where power efficiency is important. Typical applications are dc–dc converters, and power management in portable and battery powered products such as computers, printers, cellular and cordless phones. They can also be used for low voltage motor controls in mass storage products such as disk drives and tape drives. • Ultra Low RDS(on) Provides Higher Efficiency and Extends Battery Life • Logic Level Gate Drive — Can Be Driven by Logic ICs • Miniature SO–8 Surface Mount Package — Saves Board Space • Diode Is Characterized for Use In Bridge Circuits • Diode Exhibits High Speed, With Soft Recovery • IDSS Specified at Elevated Temperature • Mounting Information for SO–8 Package Provided MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Symbol Value Unit Drain–to–Source Voltage VDSS 50 Vdc Drain–to–Gate Voltage (RGS = 1.0 MΩ) VDGR 50 Vdc Gate–to–Source Voltage — Continuous VGS ± 15 Vdc Drain Current — Continuous @ TA = 25°C Drain Current — Continuous @ TA = 70°C Drain Current — Single Pulse (tp ≤ 10 µs) ID ID IDM 2.0 1.7 8.0 Adc Apk Total Power Dissipation @ TA = 25°C (1) PD 2.0 Watts Operating and Storage Temperature Range TJ, Tstg – 55 to 150 °C Thermal Resistance — Junction to Ambient R θJA 62.5 °C/W Maximum Temperature for Soldering Purposes TL 260 °C DEVICE MARKING D2N05Z ORDERING INFORMATION Device Reel Size Tape Width Quantity MMDF2N05ZR2 13 ″ 12 mm embossed tape 2500 units (1) When mounted on G10/FR–4 glass epoxy board using minimum recommended footprint. Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves — representing boundaries on device characteristics — are given to facilitate “worst case” design. Preferred devices are Motorola recommended choices for future use and best overall value. Designer’s, HDTMOS and EZFET are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc. Thermal Clad is a trade- mark of the Bergquist Company. MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MMDF2N05ZR2/D © Motorola, Inc. 1997 ™ MMDF2N05ZR2 DUAL TMOS POWER MOSFET 2.0 AMPERES 50 VOLTS RDS(on) = 0.300 OHM CASE 751–05, Style 11 SO–8 D S G Source–1 1 2 3 4 8 7 6 5 Top View Gate–1 Source–2 Gate–2 Drain–1 Drain–1 Drain–2 Drain–2 Motorola Preferred Device REV 1 |
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