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02013J0R1ABSTR Datasheet(PDF) 1 Page - AVX Corporation |
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02013J0R1ABSTR Datasheet(HTML) 1 Page - AVX Corporation |
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1 / 19 page  6 1 Accu-F ® / Accu-P® Thin-Film Technology THE IDEAL CAPACITOR The non-ideal characteristics of a real capacitor can be ignored at low frequencies. Physical size imparts inductance to the capacitor and dielectric and metal electrodes result in resistive losses, but these often are of negligible effect on the circuit. At the very high frequencies of radio communication (>100MHz) and satellite systems (>1GHz), these effects become important. Recognizing that a real capacitor will exhibit inductive and resistive impedances in addition to capacitance, the ideal capacitor for these high frequencies is an ultra low loss component which can be fully characterized in all parameters with total repeatability from unit to unit. Until recently, most high frequency/microwave capacitors were based on fired-ceramic (porcelain) technology. Layers of ceramic dielectric material and metal alloy electrode paste are interleaved and then sintered in a high temperature oven. This technology exhibits component variability in dielectric quality (losses, dielectric constant and insulation resistance), variability in electrode conductivity and variability in physical size (affecting inductance). An alternate thin-film technology has been developed which virtually eliminates these vari- ances. It is this technology which has been fully incorporated into Accu-F ® and Accu-P® to provide high frequency capaci- tors exhibiting truly ideal characteristics. The main features of Accu-F ® and Accu-P® may be summa- rized as follows: • High purity of electrodes for very low and repeatable ESR. • Highly pure, low-K dielectric for high breakdown field, high insulation resistance and low losses to frequencies above 40GHz. • Very tight dimensional control for uniform inductance, unit to unit. • Very tight capacitance tolerances for high frequency signal applications. This accuracy sets apart these Thin-Film capacitors from ceramic capacitors so that the term Accu has been employed as the designation for this series of devices, an abbreviation for “accurate.” THIN-FILM TECHNOLOGY Thin-film technology is commonly used in producing semi- conductor devices. In the last two decades, this technology has developed tremendously, both in performance and in process control. Today’s techniques enable line definitions of below 1μm, and the controlling of thickness of layers at 100Å (10 -2μm). Applying this technology to the manufacture of capacitors has enabled the development of components where both electrical and physical properties can be tightly controlled. The thin-film production facilities at AVX consist of: • Class 1000 clean rooms, with working areas under laminar-flow hoods of class 100, (below 100 particles per cubic foot larger than 0.5μm). • High vacuum metal deposition systems for high-purity electrode construction. • Photolithography equipment for line definition down to 2.0μm accuracy. • Plasma-enhanced CVD for various dielectric deposi- tions (CVD=Chemical Vapor Deposition). • High accuracy, microprocessor-controlled dicing saws for chip separation. • High speed, high accuracy sorting to ensure strict tolerance adherence. SEAL ELECTRODE DIELECTRIC ALUMINA ACCU-P CAPACITOR ELECTRODE ALUMINA TERMINATION ® |
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