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AL5811 Datasheet(PDF) 2 Page - Diodes Incorporated

Part # AL5811
Description  60V, LINEAR 75mA ADJUSTABLE CURRENT LED DRIVER
PDF  13 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

AL5811 Datasheet(HTML) 2 Page - Diodes Incorporated

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AL5811
Document number: DS35255 Rev. 1 - 2
2 of 13
www.diodes.com
January 2013
© Diodes Incorporated
AL5811
Pin Descriptions
Pin
Name
Pin Number
Function
MSOP-8EP
U-DFN3030-6
VCC
1
1
Supply Input.
Connect a 0.1μF ceramic capacitor between VCC and GND as close as possible to the device.
RSET
4
3
LED Current Setting Pin.
Connect a resistor from this pin to GND:
ILED = 750/RSET
May also be used to provide PWM dimming functionality
GND
5
4
Ground Reference Point of Device.
LED
8
6
LED Current Sink Connection.
NC
2, 3, 6, 7
2, 5
Unused
EP
Exposed Pad
Exposed Pad
Exposed Pad (bottom).
Used to improve thermal impedance of package.
It must be connected to GND directly underneath the package.
Functional Block Diagram
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol
Parameters
Ratings
Unit
VCC
Supply Voltage Relative to GND Pin (Note 4)
-0.3 to +66
V
VLED
LED Voltage Relative to GND Pin (Note 4)
-0.3 to +66
V
VRSET
RSET Voltage Relative to GND
-0.3 to +6
V
ILED
LED Pin Current Sink Current Range
85
mA
ESD HBM
Human Body Model ESD Protection
1
kV
ESD CDM
Charged Device Model ESD protection
1.2
kV
TJ
Operating Junction Temperature
-40 to +150
°C
TST
Storage Temperature
-55 to +150
°C
Notes:
4. VCC pin can be greater or smaller than VLED; neither should go below GND.
Caution:
Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may
be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when
handling and transporting these devices



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