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AL5811 Datasheet(PDF) 2 Page - Diodes Incorporated |
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AL5811 Datasheet(HTML) 2 Page - Diodes Incorporated |
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2 / 13 page ![]() AL5811 Document number: DS35255 Rev. 1 - 2 2 of 13 www.diodes.com January 2013 © Diodes Incorporated AL5811 Pin Descriptions Pin Name Pin Number Function MSOP-8EP U-DFN3030-6 VCC 1 1 Supply Input. Connect a 0.1μF ceramic capacitor between VCC and GND as close as possible to the device. RSET 4 3 LED Current Setting Pin. Connect a resistor from this pin to GND: ILED = 750/RSET May also be used to provide PWM dimming functionality GND 5 4 Ground Reference Point of Device. LED 8 6 LED Current Sink Connection. NC 2, 3, 6, 7 2, 5 Unused EP Exposed Pad Exposed Pad Exposed Pad (bottom). Used to improve thermal impedance of package. It must be connected to GND directly underneath the package. Functional Block Diagram Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol Parameters Ratings Unit VCC Supply Voltage Relative to GND Pin (Note 4) -0.3 to +66 V VLED LED Voltage Relative to GND Pin (Note 4) -0.3 to +66 V VRSET RSET Voltage Relative to GND -0.3 to +6 V ILED LED Pin Current Sink Current Range 85 mA ESD HBM Human Body Model ESD Protection 1 kV ESD CDM Charged Device Model ESD protection 1.2 kV TJ Operating Junction Temperature -40 to +150 °C TST Storage Temperature -55 to +150 °C Notes: 4. VCC pin can be greater or smaller than VLED; neither should go below GND. Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices |
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