Recommendation on PCB assembly

ESDAVLC6-1BV2

6/9

Doc ID 023822 Rev 1

4

Recommendation on PCB assembly

4.1

Stencil opening design

Stencil opening thickness: 80 µm

Figure 10.

Recommended stencil window position

4.2

Solder paste

1.

Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.

2.

“No clean” solder paste recommended.

3.

Offers a high tack force to resist component displacement during PCB movement.

4.

Solder paste with fine particles: type 4 (powder particle size 20-38 µm per

IPC J-STD-005).

4.3

Placement

1.

Manual positioning is not recommended.

2.

It is recommended to use the lead recognition capabilities of the placement system, not

the outline centering.

3.

Tolerance of ± 0.02 mm is recommended.

225

160

160

125

50

225

62.5

32.5

20

45

32.5

PCB lands

Solder lands

Stencil lands