SiP32458, SiP32459

Vishay Siliconix

Document Number: 63999

S12-2709-Rev. A, 12-Nov-12

www.vishay.com

9

This document is subject to change without notice.

PACKAGE OUTLINE

WCSP: 6 Bumps (2 x 3, 0.5 mm Pitch, 250 µm Bump Height, 1 mm x 1.5 mm Die Size)

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon

Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and

Dimension

MILLIMETERS

INCHES

Min.

Nom.

MAX.

Min.

Nom.

MAX.

A

0.540

0.580

0.620

0.0212

0.0228

0.0244

A1

0.225

0.250

0.275

0.0088

0.0098

0.0108

b

0.280

0.300

0.320

0.0110

0.0118

0.0126

e

0.500

0.0197

s

0.230

0.250

0.270

0.0090

0.0098

0.0106

D

0.920

0.960

1.000

0.0362

0.0378

0.0394

E

1.420

1.460

1.500

0.0559

0.0575

0.0591