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ADXL001-500BEZ-R7 Datasheet(PDF) 5 Page - Analog Devices |
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ADXL001-500BEZ-R7 Datasheet(HTML) 5 Page - Analog Devices |
5 / 16 page ADXL001 Rev. A | Page 5 of 16 RECOMMENDED SOLDERING PROFILE Table 3. Soldering Profile Parameters Profile Feature Sn63/Pb37 Pb-Free Average Ramp Rate (TL to TP) 3°C/sec maximum 3°C/sec maximum Preheat Minimum Temperature (TSMIN) 100°C 150°C Maximum Temperature (TSMAX) 150°C 200°C Time (TSMIN to TSMAX), ts 60 sec to 120 sec 60 sec to 150 sec TSMAX to TL Ramp-Up Rate 3°C/sec 3°C/sec Time Maintained Above Liquidous (tL) Liquidous Temperature (TL) 183°C 217°C Liquidous Time (tL) 60 sec to 150 sec 60 sec to 150 sec Peak Temperature (TP) 240°C + 0°C/−5°C 260°C + 0°C/−5°C Time Within 5°C of Actual Peak Temperature (tP) 10 sec to 30 sec 20 sec to 40 sec Ramp-Down Rate 6°C/sec maximum 6°C/sec maximum Time 25°C to Peak Temperature (tPEAK) 6 minute maximum 8 minute maximum Soldering Profile Diagram tP tL tPEAK tS PREHEAT CRITICAL ZONE TL TO TP TIME (t) RAMP-DOWN RAMP-UP TSMIN TSMAX TP TL Figure 3. Soldering Profile Diagram |
Similar Part No. - ADXL001-500BEZ-R7 |
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Similar Description - ADXL001-500BEZ-R7 |
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