W25Q16DVSVIP datasheet(71/81 Pages) WINBOND

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W25Q16DV

Publication Release Date: October 29, 2012

- 71 -

Revision D

9.3 8-Pin SOIC 208-mil (Package Code SS)

GAUGE PLANE

SYMBOL

MILLIMETERS

INCHES

Min

Nom

Max

Min

Nom

Max

1.75

1.95

2.16

0.069

0.077

0.085

0.05

0.15

0.25

0.002

0.006

0.010

1.70

1.80

1.91

0.067

0.071

0.075

0.35

0.42

0.48

0.014

0.017

0.019

0.19

0.20

0.25

0.007

0.008

0.010

5.18

5.28

5.38

0.204

0.208

0.212

5.13

5.23

5.33

0.202

0.206

0.210

5.18

5.28

5.38

0.204

0.208

0.212

5.13

5.23

5.33

0.202

0.206

0.210

(2)

1.27 BSC.

0.050 BSC.

7.70

7.90

8.10

0.303

0.311

0.319

0.50

0.65

0.80

0.020

0.026

0.031

---

0.10

---

0.004

0°

---

8°

0°

---

8°

Notes:

1. Controlling dimensions: millimeters, unless otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.

4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.

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