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STU75N3LLH6 Datasheet(PDF) 3 Page - STMicroelectronics |
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STU75N3LLH6 Datasheet(HTML) 3 Page - STMicroelectronics |
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3 / 21 page ![]() STD/P/U75N3LLH6, STU75N3LLH6-S Electrical ratings Doc ID 15978 Rev 4 3/21 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit VDS Drain-source voltage (VGS = 0) 30 V VGS Gate-source voltage ±20 V ID (1) 1. The value is rated according to Rthj-case Drain current (continuous) at TC = 25 °C 75 A ID Drain current (continuous) at TC = 70 °C 56 A ID Drain current (continuous) at TC = 100 °C 47 A IDM (2) 2. Pulse width limited by safe operating area Drain current (pulsed) 300 A PTOT Total dissipation at TC = 25 °C 60 W Derating factor 0.4 W/°C Tj Tstg Operating junction temperature storage temperature -55 to 175 °C Table 3. Thermal data Symbol Parameter Value Unit DPAK TO-220 IPAK Short IPAK Rthj-case Thermal resistance junction-case (drain) (steady state) 2.5 °C/W Rthj-amb Thermal resistance junction-amb max 100 62.5 100 °C/W Rthj-pcb (1) 1. When mounted on FR-4 board of 1in², 2oz Cu. t < 10 sec Thermal resistance junction-pcb max 35 °C/W TJ Maximum lead temperature for soldering purpose 275 300 275 °C |
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