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EvaluationBoard Datasheet(PDF) 13 Page - Intersil Corporation |
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EvaluationBoard Datasheet(HTML) 13 Page - Intersil Corporation |
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13 / 16 page ![]() ISL75052SEH 13 FN8456.0 May 29, 2013 Package Characteristics Weight of Packaged Device 0.59 Grams (Typical) Lid Characteristics Finish: Gold Potential: Connected to Pin 13 (GND) Case Isolation to Any Lead: 20 x 109 Ω (min) Die Characteristics Die Dimensions 2819μm x 5638μm (111 mils x 222 mils). Thickness: 304.8μm ± 25.4μm (12.0 mils ± 1 mil). Interface Materials GLASSIVATION Type: Silicon Oxide and Silicon Nitride Thickness: 0.3µm ± 0.03µm to 1.2µm ± 0.12µm TOP METALLIZATION Type: AlCu (99.5%/0.5%) Thickness: 2.7µm ± 0.4µm SUSTRATE Type: Silicon BACKSIDE FINISH Silicon ASSEMBLY RELATED INFORMATION SUBSTRATE POTENTIAL Ground ADDITIONAL INFORMATION WORST CASE CURRENT DENSITY < 2 x 105 A/cm2 TRANSISTOR COUNT 1074 PROCESS 0.6µm BiCMOS Junction Isolated |
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