PIC16C64A datasheet(299/334 Pages) MICROCHIP

299 / 334 page

 1997-2013 Microchip Technology Inc.

DS30234E-page 299

PIC16C6X

24.13

44-Lead Plastic Surface Mount (TQFP 10x10 mm Body 1.0/0.10 mm Lead Form) (TQ)

Note 1: Dimensions D1 and E1 do not include mold protrusion. Allowable mold protrusion is 0.25m/m (0.010”) per

side. D1 and E1 dimensions including mold mismatch.

2: Dimension “b” does not include Dambar protrusion, allowable Dambar protrusion shall be 0.08m/m

(0.003”)max.

3: This outline conforms to JEDEC MS-026.

Package Group: Plastic TQFP

Symbol

Millimeters

Inches

Min

Max

Notes

Min

Max

Notes

1.00

1.20

0.039

0.047

0.05

0.15

0.002

0.006

0.95

1.05

0.037

0.041

11.75

12.25

0.463

0.482

9.90

10.10

0.390

0.398

11.75

12.25

0.463

0.482

9.90

10.10

0.390

0.398

0.45

0.75

0.018

0.030

0.80 BSC

0.031 BSC

0.30

0.45

0.012

0.018

0.30

0.40

0.012

0.016

0.09

0.20

0.004

0.008

0.09

0.16

0.004

0.006

N44





Pin#1

1.0ø (0.039ø) Ref.

Option 1 (TOP side)

Pin#1

Option 2 (TOP side)

3.0ø (0.118ø) Ref.

Detail A

Detail B

1.00 Ref.

Base Metal

Detail A

Lead Finish

Detail B

/13(4x)

 Min

/13(4x)



R1 0.08 Min

R 0.08/0.20

Gage Plane

0.250

0.20

Min

1.00 Ref

Detail B

Note:

For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging

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