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SST12LF09-Q3CE Datasheet(PDF) 4 Page - Microchip Technology

Part # SST12LF09-Q3CE
Description  2.4 GHz High-Gain, High-Efficiency Front-end Module
PDF  15 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

SST12LF09-Q3CE Datasheet(HTML) 4 Page - Microchip Technology

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SST12LF09
DS75083A-page 4
 2013 Microchip Technology Inc.
5.0
ELECTRICAL SPECIFICATIONS
The DC and RF specifications for the power amplifier
are specified below. Refer to Table 5-2 for the DC volt-
age and current specifications.
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maxi-
mum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and func-
tional operation of the device at these conditions or conditions greater than those defined in the operational
sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may
affect device reliability.)
Tx input power to pin 5 (TX) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5 dBm
Rx input power to pin 16 (ANT with LNA ON). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5 dBm
Average Tx output power from pin 16 (ANT)1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +26 dBm
1. Never measure with CW source. Pulsed single-tone source with <50% duty cycle is recommended. Exceeding the maximum
rating of average output power could cause permanent damage to the device.
Supply Voltage at pins 3 and 4 (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +5.5V
Supply Voltage at pin 10 (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +5.5V
PA Enable Voltage to pin 6 (PEN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +3.6V
DC supply current (ICC)
2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA
2. Measured with 100% duty cycle 54 Mbps 802.11g OFDM Signal
DC supply current (IDD)
2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA
Operating Temperature (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +85ºC
Storage Temperature (TSTG). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +120ºC
Maximum Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150ºC
Surface Mount Solder Reflow Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds
TABLE 5-1:
OPERATING RANGE
Range
Ambient Temp
VCC
Extended
-40°C to +85°C
3.0-5.0V
TABLE 5-2:
DC ELECTRICAL CHARACTERISTICS AT 25°C FOR TX CHAIN
Symbol
Parameter
Min.
Typ
Max.
Unit
VCC
Supply Voltage at pins 3 and 4
3.0
3.6
5.0
V
VDD
Supply Voltage at pin 10
3.0
3.6
5.0
V
ICQ
Tx Idle current for 802.11g to meet EVM ~3% @ 17 dBm
105
mA
VPEN
Tx Enable Voltage
3.05
3.10
3.15
V
ICC
Tx Supply Current
for 11g OFDM 54 Mbps signal, POUT = 17 dBm
170
mA
IDD
Rx Supply Current (with LNA ON)
9mA



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