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MLF1005L Datasheet(PDF) 8 Page - TDK Electronics

Part # MLF1005L
Description  Inductors for Standard Circuits Multilayer/STD magnetic shielded MLF series
PDF  10 Pages
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Manufacturer  TDK [TDK Electronics]
Direct Link  http://www.tdk.com
Logo TDK - TDK Electronics

MLF1005L Datasheet(HTML) 8 Page - TDK Electronics

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• All specifications are subject to change without notice.
(7/9)
001-05 / 20111129 / e511_mlf_02
Inductors for Standard Circuits
Multilayer/STD • Magnetic Shielded
MLF Series MLF2012
FEATURES
• High-reliability monolithic structure.
• Ferrite core and magnetic shielding enables the design of com-
pact circuits with high density mounting.
• Excellent solderability and high heat resistance permits either
flow or reflow soldering.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Digital cellular phone, car audio, TV, personal computers, or vari-
ous electronic appliances
SPECIFICATIONS
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L
×W
(3) Type name
(4) Inductance
(5) Tolerance
(6) Packaging style
(7) TDK internal code
PACKAGING STYLE AND QUANTITIES
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
Conformity to RoHS Directive
Operating temperature range
–40 to +85°C
Storage temperature range
–40 to +85°C(After mount)
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
MLF 2012
A 1R0
K
T
(1)
(2)
(3)
(4)
(5) (6)
(7)
2012
2.0
×1.25mm
47N
47nH[0.047
µH]
R15
0.15
µH
1R0
1
µH
100
10
µH
K
±10%
M
±20%
T
Taping [reel]
Packaging style
Product’s thickness
Quantity
Taping
0.85mm
4000 pieces/reel
1.25mm
2000 pieces/reel
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.



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