TL783CKTTRG3 datasheet(2/20 Pages) TI1

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Protection

Circuit

OUT

Vref

Error

Amplifier

ADJ

O [ Vref 1 )

Absolute Maximum Ratings

(1)

Package Thermal Data

(1)

Recommended Operating Conditions

TL783

SLVS036M – SEPTEMBER 1981 – REVISED APRIL 2008 ............................................................................................................................................... www.ti.com

FUNCTIONAL BLOCK DIAGRAM

over operating temperature range (unless otherwise noted)

MIN

MAX

UNIT

Vl – VO

Input-to-output differential voltage

125

Operating virtual junction temperature

150

°C

Tstg

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

PACKAGE

BOARD

(2)

PowerFLEX (KTE)

High K, JESD 51-5

2.7

°C/W

TO-263 (KTT)

High K, JESD 51-5

°C/W

1.94

°C/W

25.3

°C/W

TO-220 (KC)

High K, JESD 51-5

°C/W

(1)

Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. Due to variations in

individual device electrical characteristics and thermal resistance, the built-in thermal overload protection may be activated at power

levels slightly above or below the rated dissipation.

(2)

For packages with exposed thermal pads, such as QFN, PowerPAD™, or PowerFLEX,

JP is defined as the thermal resistance between

the die junction and the bottom of the exposed pad.

MIN

MAX

UNIT

Vl – VO

Input-to-output differential voltage

125

Output current

700

Operating virtual junction temperature

125

°C

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