MPX5050 SERIES

3

Motorola Sensor Device Data

Figure 3 illustrates the Differential/Gauge Sensing Chip in

the basic chip carrier (Case 867). A fluorosilicone gel isolates

the die surface and wire bonds from the environment, while

allowing the pressure signal to be transmitted to the sensor

diaphragm.

The MPX5050 series pressure sensor operating charac-

teristics, and internal reliability and qualification tests are

based on use of dry air as the pressure media. Media, other

than dry air, may have adverse effects on sensor perfor-

mance and long–term reliability. Contact the factory for in-

formation regarding media compatibility in your application.

Figure 4 shows a typical decoupling circuit for interfacing

the integrated sensor to the A/D input of a microprocessor.

Proper decoupling of the power supply is recommended.

Figure 2 shows the sensor output signal relative to pres-

sure input. Typical, minimum, and maximum output curves

are shown for operation over a temperature range of 0

85

urate outside of the specified pressure range.)

Figure 2. Output versus Pressure Differential

MAX

DIFFERENTIAL PRESSURE (kPa)

5.0

4.0

3.0

2.0

0

55

35

15

0

45

25

4.5

3.5

2.5

1.5

5

TRANSFER FUNCTION:

Vout = VS*(0.018*P+0.04) ± ERROR

VS = 5.0 Vdc

TEMP = 0 to 85

°C

1.0

0.5

50

30

10

40

20

MIN

TYPICAL

Figure 3. Cross–Sectional Diagram

(Not to Scale)

FLUORO SILICONE

GEL DIE COAT

WIRE BOND

LEAD FRAME

DIE

STAINLESS STEEL

METAL COVER

EPOXY

PLASTIC

CASE

DIFFERENTIAL/GAUGE ELEMENT

DIE

BOND

µ PROCESSOR

A/D

51 k

50 pF

MPX5050

OUPUT

(PIN 1)

Figure 4. Typical Decoupling Filter for Sensor to

Microprocessor Interface

P1

P2