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Dual Cool Package

3.3mm x 3.3mm

PQFN

3.3mm x 3.3mm

120.00

100.00

80.00

60.00

40.00

20.00

0.00

15

10 15 20 25 30 35

Load (A)

1-Phase CCM with Heat Sink and Forced Air 200LFM

Board

Solderable Component

Area

DirectFET

% Difference

Solderable Area

Total

Component Area (Max)

Dual Cool Package

3.3mm x 3.3mm

The new

standard

Competitor

33% less

Top

Dual Cool Package

Competitor Package

Bottom

5mm x 6mm Package

Product Number

Technology

BV

DSS

V

GS

R

Qg

Qgd

10V

8V

6V

4.5V

(nC)

(nC)

FDMS8570SDC

Y

25

20

2.8

-

-

3.3

22

4.4

FDMS7650DC

N

30

20

0.99

-

-

1.55

42

9.7

FDMS3006SDC

Y

30

20

1.9

-

-

2.7

26

5.3

FDMS3008SDC

Y

30

20

2.6

-

-

3.3

21

4.3

FDMS3016DC

N

30

20

6

-

-

9

7.6

2.5

FDMS8320LDC

N

40

20

1.1

-

-

1.5

57

16

FDMS86500DC

N

60

20

2.3

3.3

-

-

76

15

FDMS86300DC

N

80

20

3.1

4

-

-

72

14

FDMS86101DC

N

100

20

7.5

-

12

-

31

7

FDMS86200DC

N

150

20

17

-

25

-

30

5.6

3.3mm x 3.3mm Package

Product Number

SyncFET

Technology

BV

DSS

V

GS

R

Qg

Qgd

10V

8V

6V

4.5V

(nC)

(nC)

FDMC7660DC

N

30

20

-

-

-

-

-

-

FDMC86520DC

N

60

20

6.3

8.7

-

-

29

5.5

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