PI3B3125/PI3B3126

w/Individual Enables

6

PS8153F

09/09/04

Pericom Semiconductor Corporation • 1-800-435-2336 • www.pericom.com

Packaging Mechanical: 16-pin QSOP (Q)

.189

.197

.053

.069

.004

.010

SEATING

PLANE

.025

BSC

.007

.010

.228

.244

1

16

.150

.157

.016

.050

X.XX

X.XX

DENOTES DIMENSIONS IN MILLIMETERS

0.635

4.80

5.00

1.35

1.75

5.79

6.19

0.101

0.254

.008

.012

0.203

0.305

3.81

3.99

0.178

0.254

0.38

0.41

1.27

.008

0.203

.015 x 45

°

REF

Detail A

Detail A

.008

0.20

MIN.

Guage Plane

.010

0.254

.041

1.04

REF

.016

.035

0.41

0.89

0˚-6˚

.008

.013

0.20

0.33

Ordering Information

Ordering Code

Package Code

Package Desciption

PI3B3125L

L

14-Pin TSSOP

PI3B3125LE

L

Pb-free & Green, 14-Pin TSSOP

PI3B3125W

W

14-pin SOIC

PI3B3125WE

W

Pb-free & Green, 14-pin SOIC

PI3B3125Q

Q

16-pin QSOP

PI3B3125QE

Q

Pb-free & Green, 16-pin QSOP

PI3B3126L

L

14-Pin TSSOP

PI3B3126LE

L

Pb-free & Green, 14-Pin TSSOP

PI3B3126W

W

14-pin SOIC

PI3B3126WE

W

Pb-free & Green, 14-pin SOIC

PI3B3126Q

Q

16-pin QSOP

PI3B3126QE

Q

Pb-free & Green, 16-pin QSOP

Notes:

1. Thermal Characteristics can be found on the web at www.pericom.com/packaging/