LP38692MP-3.3SLASHNOPB datasheet(3/28 Pages) TI1

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LP38690, LP38692

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SNVS322J – DECEMBER 2004 – REVISED APRIL 2013

ABSOLUTE MAXIMUM RATINGS

(1) (2)

Storage Temperature Range

−65°C to +150°C

Lead Temp. (Soldering, 5 seconds)

260°C

ESD Rating(3)

2 kV

Power Dissipation(4)

Internally Limited

V(max) All pins (with respect to GND)

-0.3V to 12V

IOUT

(5)

Internally Limited

Junction Temperature

−40°C to +150°C

(1)

Absolute maximum ratings indicate limits beyond which damage to the component may occur. Operating ratings indicate conditions for

which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications, see Electrical

Characteristics. Specifications do not apply when operating the device outside of its rated operating conditions.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

ESD is tested using the human body model which is a 100pF capacitor discharged through a 1.5k resistor into each pin.

(4)

At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink values (if a

heatsink is used). The junction-to-ambient thermal resistance (

θJ-A) for the PFM is approximately 90°C/W for a PC board mounting with

the device soldered down to minimum copper area (less than 0.1 square inch). If one square inch of copper is used as a heat dissipator

for the PFM, the

θJ-A drops to approximately 50°C/W. The SOT-223 package has a θJ-A of approximately 125°C/W when soldered down

to a minimum sized pattern (less than 0.1 square inch) and approximately 70°C/W when soldered to a copper area of one square inch.

The

θJ-A values for the WSON package are also dependent on trace area, copper thickness, and the number of thermal vias used (refer

to the TI AN-1187 Application Report and the WSON MOUNTING section in this datasheet). If power dissipation causes the junction

temperature to exceed specified limits, the device will go into thermal shutdown.

(5)

If used in a dual-supply system where the regulator load is returned to a negative supply, the output pin must be diode clamped to

ground.

OPERATING RATINGS

VIN Supply Voltage

2.7V to 10V

Operating Junction Temperature Range

−40°C to +125°C

ELECTRICAL CHARACTERISTICS

Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the full operating temperature range.

Unless otherwise specified: VIN = VOUT + 1V, CIN = COUT = 10 µF, ILOAD = 10mA. Min/Max limits are specified through testing,

statistical correlation, or design.

Symbol

Parameter

Conditions

Min

Typ(1)

Max

Units

-2.5

2.5

Output Voltage Tolerance

%VOUT

100 µA < IL < 1A

-5.0

5.0

VO + 1V ≤ VIN ≤ 10V

ΔVO/ΔVIN

Output Voltage Line Regulation(2)

VO + 0.5V ≤ VIN ≤ 10V

0.03

0.1

%/V

IL = 25mA

ΔVO/ΔIL

Output Voltage Load Regulation(3)

1 mA < IL < 1A

1.8

%/A

VIN = VO + 1V

(VO = 1.8V)

950

1600

IL = 1A

(VO = 2.5V)

145

IL = 0.1A

800

1300

IL = 1A

VIN - VOUT

Dropout Voltage(4)

(VO = 3.3V)

110

IL = 0.1A

650

1000

IL = 1A

(VO = 5V)

100

IL = 0.1A

450

800

IL = 1A

(1)

Typical numbers represent the most likely parametric norm for 25°C operation.

(2)

Output voltage line regulation is defined as the change in output voltage from nominal value resulting from a change in input voltage.

(3)

Output voltage load regulation is defined as the change in output voltage from nominal value as the load current increases from 1mA to

full load.

(4)

Dropout voltage is defined as the minimum input to output differential required to maintain the output within 100mV of nominal value.

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