AD5544ARSZ datasheet(27/28 Pages) AD

27 / 28 page

Data Sheet

AD5544/AD5554

Rev. F | Page 27 of 28

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-150-AH

10.50

10.20

9.90

8.20

7.80

7.40

5.60

5.30

5.00

SEATING

PLANE

0.05 MIN

0.65 BSC

2.00 MAX

0.38

0.22

COPLANARITY

0.10

1.85

1.75

1.65

0.25

0.09

0.95

0.75

0.55

8°

4°

0°

Figure 36. 28-Lead Shrink Small Outline Package [SSOP]

(RS-28)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

EXPOSED

PAD

PIN 1

INDICATOR

3.65

3.50 SQ

3.45

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.25 MIN

Figure 37. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

5 mm × 5 mm Body, Very Very Thin Quad

(CP-32-11)

Dimensions shown in millimeters

AD5544ARSZ Datasheet(PDF) 27 Page - Analog Devices

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