THS4012CD datasheet(19/35 Pages) TI

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D +

MAX *

DGNPackage

θJA =58.4°C/W

2-ozTraceandCopperPad

WithSolder

DGNPackage

θJA =158°C/W

2-ozTraceand

CopperPad

WithoutSolder

SOICPackage

High-KTestPCB

θJA =98°C/W

TJ =150°C

SOICPackage

Low-KTestPCB

θJA =167°C/W

1.5

−40

−20

2.5

3.5

100

0.5

TA − Free-AirTemperature − °C

THS4011

THS4012

www.ti.com

SLOS216E – JUNE 1999 – REVISED APRIL 2010

Where:

PD = Maximum power dissipation of THS401x IC (watts)

TMAX = Absolute maximum junction temperature (150°C)

TA = Free-ambient air temperature (°C)

qJA = qJC + qCA

qJC = Thermal coefficient from junction to case

qCA = Thermal coefficient from case to ambient air (°C/W)

Results are with no airflow and PCB size = 3 in × 3 in

Figure 35. Maximum Power Dissipation vs Free-Air Temperature

More complete details of the PowerPAD installation process and thermal-management techniques can be found

in the TI technical brief, PowerPAD™ Thermally-Enhanced Package. This document can be found at the TI web

site (www.ti.com) by searching on the keyword PowerPAD. The document can also be ordered through your

local TI sales office. Refer to literature number SLMA002 when ordering.

The next consideration is the package constraints. The two sources of heat within an amplifier are quiescent

power and output power. The designer should never forget about the quiescent heat generated within the device,

especially multiple amplifier devices. Because these devices have linear output stages (Class A-B), most of the

heat dissipation is at low output voltages with high output currents. Figure 36 to Figure 39 show this effect, along

with the quiescent heat, with an ambient air temperature of 50°C. When using VCC = ±5 V, there is generally not

a heat problem, even with SOIC packages. But, when using VCC = ±15 V, the SOIC package is severely limited

in the amount of heat it can dissipate. The other key factor when looking at these graphs is how the devices are

mounted on the PCB. The PowerPAD devices are extremely useful for heat dissipation. But, the device should

always be soldered to a copper plane to fully use the heat-dissipation properties of the PowerPAD package. The

SOIC package, on the other hand, is highly dependent on how it is mounted on the PCB. As more trace and

copper area is placed around the device, qJA decreases and the heat dissipation capability increases. The

currents and voltages shown in these graphs are for the total package. For the dual amplifier package

(THS4012), the sum of the RMS output currents and voltages should be used to choose the proper package.

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