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MB8S Datasheet(PDF) 1 Page - Kingtronics International Company

Part # MB8S
Description  Single Phase 0.8 AMPS. Glass Passivated Bridge Rectifiers Voltage Range 200 to 1000 Volts Current 0.8 Amperes
PDF  2 Pages
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Manufacturer  KINGTRONICS [Kingtronics International Company]
Direct Link  http://www.kingtronics.com
Logo KINGTRONICS - Kingtronics International Company

MB8S Datasheet(HTML) 1 Page - Kingtronics International Company

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Website: www.kingtronics.com
Email: info@kingtronics.com
Tel: (852) 8106 7033
Fax: (852) 8106 7099
1
MB2S THRU MB10S
Single Phase 0.8 AMPS. Glass Passivated Bridge Rectifiers
Voltage Range 200 to 1000 Volts Current 0.8 Amperes
FEATURES
◆
Ideal for printed circuit board
◆
Reliable low cost construction technique
results in inexpensive product
◆
High temperature soldering guaranteed:
260
/ 10 seconds / 0.375” ( 9.5mm )
℃
lead length at 5 lbs., ( 2.3 kg ) tension
◆
UL Recognized File number: E347214
MECHANICAL DATA
◆
Case: Molded plastic
◆
Lead: solder plated
◆
Polarity: As marked
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25℃ ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, resistive or inductive load.For capacitive load, derate current by 20%
SYMBOLS
MB2S
MB4S
MB6S
MB8S
MB10S
UNITS
Maximum Repetitive Peak Reverse Voltage
VRRM
200
400
600
800
1000
V
Maximum RMS Voltage
VRMS
140
280
420
560
700
V
Maximum DC Blocking Voltage
VDC
200
400
600
800
1000
V
Maximum Average Forward Rectified Current
On glass-epoxy P.C.B.
On aluminum substrate
I(AV)
0.5
0.8
A
Peak Forward Surge Current,
8.3ms Single Half Sine-wave Superimposed on
Rated Load (JEDEC method )
IFSM
35
A
Maximum Instantaneous Forward Voltage at 0.4A
VF
1.0
V
Maximum DC Reverse Current @ TA=25℃
Rated DC Blocking voltage per leg TA=125℃
IR
5.0
500
μA
Typical Thermal Resistance (Note1)
(Note2)
RθJA
RθJL
70
20
℃
/W
Operating Temperature Range
TJ
-55 to +150
℃
Storage Temperature Range
TSTG
-55 to +150
℃
Note:
1.On aluminum suvstrate P.C.B. with an area of 0.8×0.8”(20×20mm) mounted on 0.05×0.05”(1.3×1.3mm) solder pad.
2. Thermal Resistance from Junction to Case with units Mounted on 2.6×1.4×0.06”Thick(6.5×3.5×0.15cm)Al.Plate.


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