Data Sheet

ADP124/ADP125

Rev. C | Page 17 of 20

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-187-AA-T

0.70

0.55

0.40

8°

0°

0.94

0.86

0.78

SEATING

PLANE

1.10 MAX

0.15

0.10

0.05

0.40

0.33

0.25

5.05

4.90

4.75

2.26

2.16

2.06

1.83

1.73

1.63

3.10

3.00

2.90

3.10

3.00

2.90

8

5

4

1

0.65 BSC

0.525 BSC

PIN 1

INDICATOR

COPLANARITY

0.10

0.23

0.18

0.13

TOP

VIEW

BOTTOM VIEW

EXPOSED

PAD

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 45. 8-Lead Mini Small Outline Package with Exposed Pad [MINI_SO_EP]

(RH-8-1)

Dimensions shown in millimeters

TOP VIEW

8

1

5

4

BOTTOM VIEW

(WITH EXPOSED PAD)

PIN 1 INDEX

AREA

2.00

BSC SQ

SEATING

PLANE

0.60

0.55

0.50

0.20 REF

0.20 MIN

0.05 MAX

0.02 NOM

0.30

0.25

0.20

1.10

1.00

0.90

1.70

1.60

1.50

0.50

BSC

PIN 1

INDICATOR

(R 0.10)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.30

0.25

0.18

COPLANARITY

0.05

Figure 46. 8-Lead Lead Frame Chip Scale Package [LFCSP_UD]

2 mm × 2 mm Body, Ultra Thin, Dual Lead

(CP-8-8)

Dimensions shown in millimeters