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BAS16 Datasheet(PDF) 13 Page - NXP Semiconductors |
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BAS16 Datasheet(HTML) 13 Page - NXP Semiconductors |
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13 / 20 page  BAS16_SER_5 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 05 — 25 August 2008 13 of 20 NXP Semiconductors BAS16 series High-speed switching diodes Reflow soldering is the only recommended soldering method. Fig 21. Reflow soldering footprint BAS16L (SOD882) Fig 22. Reflow soldering footprint BAS16T (SOT416/SC-75) solder lands solder resist occupied area solder paste sod882_fr 0.9 0.3 (2 ×) R0.05 (8 ×) 0.6 (2 ×) 0.7 (2 ×) 0.4 (2 ×) 1.3 0.7 Dimensions in mm solder lands solder resist occupied area solder paste sot416_fr 0.85 1.7 2.2 2 0.5 (3 ×) 0.6 (3 ×) 1 1.3 Dimensions in mm |
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