Production Datasheet

3

87C196CB - Automotive

3.0

Process Information

These devices are manufactured on P629.5, a CHMOS III-E process. Additional process and

reliability information is available in Intel's Components Quality and Reliability Handbook, Order

Number 210997.

All thermal impedance data is approximate for static air conditions at 1 W of power dissipation.

Values change depending on operation conditions and application. See the Intel Packaging

Handbook (order number 240800) for a description of Intel's thermal impedance test methodology.

Figure 2. The 87C196CB - Automotive Family Nomenclature

A4610-01

AX 87 CC

20

B

19 6

Frequency Designation:

20 = 20 MHz

No Mark = 16 MHz

7 = EPROM, OTP

Product Designation

Product Family

CHMOS Technology

Program Memory Options:

N = PLCC

(plastic leaded chip carrier)

S = QFP

(Quad Flatpack)

Package Type Options:

A = -40

ambient with

Intel Standard Burn-in

Temperature and Burn-in Options:

x x

x

x

x

Table 2. Thermal Characteristics

Device and Package

xx87C196CB

(84-Lead PLCC Package)

35°C/W

11°C/W

NOTES:

1.

taken 1 ft. away from case in air flow environment.

2. All values of

much airflow)

3. and device power dissipation at temperature of operation. Typical variations are ± 2°C/W.

4. Values listed are at a maximum power dissipation of 1 W.

5. To address the fact that many of the package prefix variables have changed, all package prefix variables in

this document are now indicated with an "x".