DSA 20 C 150PB

advanced

I

RMS

A

per pin*

35

R

thCH

K/W

0.50

M

D

Nm

0.6

mounting torque

0.4

T

stg

°C

150

storage temperature

-55

Weight

g

2

C

G

L

K

J

N

M

R

Q

Dim.

Millimeter

Inches

Min.

Max.

Min.

Max.

A

12.70 13.97

0.500 0.550

B

14.73 16.00

0.580 0.630

C

9.91

10.66

0.390 0.420

D

3.54

4.08

0.139 0.161

E

5.85

6.85

0.230 0.270

F

2.54

3.18

0.100 0.125

G

1.15

1.65

0.045 0.065

H

2.79

5.84

0.110 0.230

J

0.64

1.01

0.025 0.040

K

2.54

BSC

0.100 BSC

M

4.32

4.82

0.170 0.190

N

1.14

1.39

0.045 0.055

Q

0.35

0.56

0.014 0.022

R

2.29

2.79

0.090 0.110

Symbol

Definition

Ratings

typ.

max.

min.

Conditions

RMS current

thermal resistance case to heatsink

Unit

* Irms is typically limited by: 1. pin-to-chip resistance; or by 2. current capability of the chip.

In case of 1, a common cathode/anode configuration and a non-isolated backside, the whole current capability can be used by connecting

the backside.

Outlines TO-220AB

F

C

N

60

mounting force with clip

20

IXYS reserves the right to change limits, conditions and dimensi

© 2005 IXYS all rights reserved

Data according to IEC 60747and per diode unless otherwise specified