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TDA8950 Datasheet(PDF) 39 Page - NXP Semiconductors |
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TDA8950 Datasheet(HTML) 39 Page - NXP Semiconductors |
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39 / 39 page  NXP Semiconductors TDA8950 2 × 150 W class-D power amplifier © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 11 June 2009 Document identifier: TDA8950_2 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 5 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Functional description . . . . . . . . . . . . . . . . . . . 5 8.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8.2 Pulse-width modulation frequency . . . . . . . . . . 8 8.3 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 8.3.1 Thermal protection . . . . . . . . . . . . . . . . . . . . . . 8 8.3.1.1 Thermal FoldBack (TFB) . . . . . . . . . . . . . . . . . 8 8.3.1.2 OverTemperature Protection (OTP) . . . . . . . . . 9 8.3.2 OverCurrent Protection (OCP) . . . . . . . . . . . . . 9 8.3.3 Window Protection (WP). . . . . . . . . . . . . . . . . 10 8.3.4 Supply voltage protection . . . . . . . . . . . . . . . . 11 8.4 Differential audio inputs . . . . . . . . . . . . . . . . . 11 9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12 10 Thermal characteristics. . . . . . . . . . . . . . . . . . 12 11 Static characteristics. . . . . . . . . . . . . . . . . . . . 13 12 Dynamic characteristics . . . . . . . . . . . . . . . . . 14 12.1 Switching characteristics . . . . . . . . . . . . . . . . 14 12.2 Stereo SE configuration characteristics . . . . . 15 12.3 Mono BTL application characteristics . . . . . . . 16 13 Application information. . . . . . . . . . . . . . . . . . 17 13.1 Mono BTL application . . . . . . . . . . . . . . . . . . . 17 13.2 Pin MODE. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 13.3 Estimating the output power . . . . . . . . . . . . . . 17 13.3.1 Single-Ended (SE) . . . . . . . . . . . . . . . . . . . . . 17 13.3.2 Bridge-Tied Load (BTL) . . . . . . . . . . . . . . . . . 18 13.4 External clock . . . . . . . . . . . . . . . . . . . . . . . . . 18 13.5 Heatsink requirements . . . . . . . . . . . . . . . . . . 19 13.6 Pumping effects . . . . . . . . . . . . . . . . . . . . . . . 20 13.7 Application schematic . . . . . . . . . . . . . . . . . . . 21 13.8 Curves measured in reference design . . . . . . 23 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 32 15 Soldering of SMD packages . . . . . . . . . . . . . . 34 15.1 Introduction to soldering . . . . . . . . . . . . . . . . . 34 15.2 Wave and reflow soldering . . . . . . . . . . . . . . . 34 15.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 34 15.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 35 16 Soldering of through-hole mount packages . 36 16.1 Introduction to soldering through-hole mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 16.2 Soldering by dipping or by solder wave . . . . . 36 16.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 36 16.4 Package related soldering information . . . . . . 37 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . 37 18 Legal information . . . . . . . . . . . . . . . . . . . . . . 38 18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 38 18.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 18.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 38 18.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 38 19 Contact information . . . . . . . . . . . . . . . . . . . . 38 20 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 |
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