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AD8639ARMZ-R7 Datasheet(PDF) 17 Page - Analog Devices |
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AD8639ARMZ-R7 Datasheet(HTML) 17 Page - Analog Devices |
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17 / 20 page ![]() AD8638/AD8639 Rev. F | Page 17 of 20 COMPLIANT TO JEDEC STANDARDS MO-187-AA 6° 0° 0.80 0.55 0.40 4 8 1 5 0.65 BSC 0.40 0.25 1.10 MAX 3.20 3.00 2.80 COPLANARITY 0.10 0.23 0.09 3.20 3.00 2.80 5.15 4.90 4.65 PIN 1 IDENTIFIER 15° MAX 0.95 0.85 0.75 0.15 0.05 Figure 57. 8-Lead Mini Small Outline Package [MSOP] (RM-8) Dimensions shown in millimeters PIN 1 INDICATOR (R 0.2) EXPOSED PAD BOTTOM VIEW TOP VIEW 1 4 8 5 INDEX AREA 3.00 BSC SQ SEATING PLANE 0.80 0.75 0.70 0.30 0.25 0.18 0.05 MAX 0.02 NOM 0.80 MAX 0.55 NOM 0.20 REF 0.50 BSC COPLANARITY 0.08 2.48 2.38 2.23 1.74 1.64 1.49 0.50 0.40 0.30 COMPLIANT TO JEDEC STANDARDS MO-229-WEED-4 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION SECTIONOFTHISDATASHEET. Figure 58. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD] 3 mm × 3 mm Body, Very Very Thin, Dual Lead (CP-8-5) Dimensions shown in millimeters |
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