2

Conductive adhesion

An alternative to soldering is the gluing of thermistors with conductive adhesives. The benefit of

this method is that it involves no thermal stress. The adhesives used must be chemically inert.

3

Sealing and potting

When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused

by thermal expansion during the production process (curing / overmolding process) and during

later operation. The upper category temperature of the thermistor must not be exceeded. Ensure

that the materials used (sealing / potting compound and plastic material) are chemically neutral.

4

Cleaning

If cleaning is necessary, mild cleaning agents such as ethyl alcohol and cleaning gasoline are

recommended. Cleaning agents based on water are not allowed. Ultrasonic cleaning methods are

permissible.

5

Storage

In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.

Humidity, temperature and container materials are critical factors.

Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing ma-

terial may be deformed or SMDs may stick together, causing problems during mounting. After

opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible.

The components should be left in the original packing. Touching the metallization of unsoldered

thermistors may change their soldering properties.

Storage temperature:

25

°C up to 45 °C

Relative humidity (without condensation):

≤75% annual mean

<95%, maximum 30 days per annum

Solder the thermistors listed in this data book after shipment from EPCOS within the time speci-

fied:

SMDs:

12 months

Leaded components:

24 months

Temperature measurement and compensation

B573**V2

SMD NTC thermistors, case size 0603 (1608)

Page 14 of 20

Please read Cautions and warnings and

Important notes at the end of this document.