DESCRIPTION

Rugged surface mount mezzanine connector incorporating “super-redundant”

Mini-Box contact system for separable interface.

Designed for 10mm and 12mm stack heights in both 60 and 114 positions.

APPLICATIONS

Stacking or mezzanine applications

114 position is designed to support VITA 61 XMC architecture as rugged

alternative to VITA 42 XMC

60 position designed for custom architecture stacking applications

ELECTRICAL

Stacking or mezzanine applications

114 position is designed to support VITA 61 XMC architecture as rugged

alternative to VITA 42 XMC

60 position designed for custom architecture stacking applications

MECHANICAL

500 mating cycles durability

Mating force: 0.30 lb. max. times number of contacts

-65˚C to +125˚C operating temperature

Shock and vibration per VITA 47 requirements

MATERIALS

Pin Assembly:

LCP plastic housings, white in color

Socket Assembly:

LCP plastic housings, white in color

Contacts:

High Performance Copper Alloy, 50µ” Au in mating interface

(Sn/Pb and SAC305 solder balls are available)

STANDARDS & SPECS

114 position conforms to requirement of VITA 61 (VITA 42 Alternate)

VITA 42 and VITA 61 are not intermateable, but are footprint and XMC

architecture compatible

APPLICATION TOOLING

Product is installed via standard BGA surface mount processes.

Mezalok Connector

Tyco Electronics

I Mezalok

KEY FEATURES

60 and 114 positions

Mini-Box contact system

provides 4 points of

contact for ultra reliability

LCP plastic housings offer

superior thermal stability

and are low-outgassing

Compliant BGA board

attach supports standard

surface mount processing

and excellent thermal

stability

114 position footprint

compatible to XMC foot-

print and all dimensional

constraints