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APW7322 Datasheet(PDF) 2 Page - Anpec Electronics Coropration |
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APW7322 Datasheet(HTML) 2 Page - Anpec Electronics Coropration |
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2 / 22 page ![]() Copyright © ANPEC Electronics Corp. Rev. A.6 - Aug., 2013 APW7322/A www.anpec.com.tw 2 Ordering and Marking Information Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Absolute Maximum Ratings (Note 1) Symbol Parameter Rating Unit VIN, VCC VIN and VCC Input Voltage -0.3 ~ 7 V >20ns -1 ~VIN+0.3 VLX LX to GND Voltage <20ns VPGND -5V ~9V V FB, EN, POK to GND Voltage -0.3 ~ 6.5 V PD Power Dissipation Internally Limited W TJ Junction Temperature 150 oC TSTG Storage Temperature -65 ~ 150 oC TSDR Maximum Lead Soldering Temperature(10 Seconds) 260 oC Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom- mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability Thermal Characteristics Symbol Parameter Typical Value Unit θ JA Junction-to-Ambient Resistance in Free Air (Note 2) SOP-8 TDFN3x3-10 150 50 oC/W θ JC Junction-to-Case Resistance in Free Air (Note 3) SOP-8 TDFN3x3-10 20 6 oC/W Note 2: θ JA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad of SOP-8 and TDFN3x3-10 is soldered directly on the PCB. Note 3: The case temperature is measured at the center of the exposed pad on the underside of the SOP-8 package. APW7322 Handling Code Temperature Range Package Code Assembly Material Package Code K : SOP-8 QB : TDFN3x3-10 Operating Ambient Temperature Range I : -40 to 85 oC Handling Code TR : Tape & Reel Assembly Material G : Halogen and Lead Free Device APW7322 K: XXXXX - Date Code APW7322 XXXXX APW7322A K: XXXXX - Date Code APW7322A XXXXX APW7322A APW7322 QB: XXXXX - Date Code APW 7322 XXXXX APW7322A QB: XXXXX - Date Code APW 7322A XXXXX |
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