Copyright

© ANPEC Electronics Corp.

Rev. A.4 - Aug., 2013

APW7324

www.anpec.com.tw

2

Ordering and Marking Information

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

Symbol

Parameter

Rating

Unit

VIN and VCC Input Voltage

-0.3 ~ 7

V

LX to GND Voltage

V

FB, EN, POK to GND Voltage

-0.3 ~ 6.5

V

Power Dissipation

Internally Limited

W

Junction Temperature

150

Storage Temperature

-65 ~ 150

Maximum Lead Soldering Temperature(10 Seconds)

260

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Junction-to-Ambient Resistance in Free Air (Note 2)

50

θ

JC

Junction-to-Case Resistance in Free Air (Note 3)

10

Note 2:

θ

of SOP-8P is soldered directly on the PCB.

Note 3: The case temperature is measured at the center of the exposed pad on the underside of the SOP-8P package.

APW7324

Handling Code

Temperature Range

Package Code

Assembly Material

Package Code

KA: SOP-8P QB : TDFN3x3-10

Operating Ambient Temperature Range

I : -40 to 85

Handling Code

TR : Tape & Reel

Assembly Material

G : Halogen and Lead Free Device

APW7324 KA:

XXXXX - Date Code

APW7324

XXXXX

APW7324 QB:

XXXXX - Date Code

APW

7324

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