CH

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Vishay Sfernice

Revision: 28-Aug-13

4

Document Number: 53014

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Note

• Historical part numbers are not recommended but can still be used for ordering.

GLOBAL PART NUMBER INFORMATION

New Global Part Numbering: CH0402-50RJF (preferred part number format)

GLOBAL MODEL

SIZE

OHMIC VALUE

TOLERANCE

PACKAGING

OPTION

CH

02016

0402

0603

10R to 500R

F = 1 %

G = 2 %

J = 5 %

K = 10 %

F (Flip Chip):

SnAg over nickel barrier

N (W/A):

SnAg over nickel barrier

(except 02016)

Gold bonding pads

G (W/A): Gold

(except 02016)

For more

information see

Codification of

Packaging table

From

1 to 3 digits.

Leave blank

if no option.

Historical Part Number example: CH02016-100RGFPT1K (tapes of 1K pieces)



CH0402-50RJF

(waffle pack)

CODIFICATION OF PACKAGING

WAFFLE PACK (standard packaging for CH0402 and CH0603)

W

10 min., 1 mult

PLASTIC TAPE (standard packaging for CH02016 and CH0603)

T

100 min., 1 mult

TA

100 min., 100 mult

TB

250 min., 250 mult

TC

500 min., 500 mult

TD

1000 min., 1000 mult

TE

2500 min., 2500 mult

TF

Full tape (qunatity depending on size of chips)

PAPER TAPE (standard packaging for CH0402 - available for CH0603)

PT

100 min., 1 mult

PA

100 min., 100 mult

PB

250 min., 250 mult

PC

500 min., 500 mult

PD

1000 min., 1000 mult

PE

2500 min., 2500 mult

PF

Full tape (qunatity depending on size of chips)

TYPICAL HIGH FREQUENCY PERFORMANCE ELECTRICAL MODEL

C

Internal shunt capacitance

L

Internal inductance

R

Resistance

Z

Internal impedance (R, L, C)

External connection inductance

External capacitance to ground

L

c

C

g

Z

0

C

L

R

Z

Z

0

L

c

H0

4

0

2

-

5

0

R

C

JF

9

T

9

9