Copyright

© ANPEC Electronics Corp.

Rev. A.3 - Jul., 2010

www.anpec.com.tw

3

APA2175

Symbol

Parameter

Rating

Unit

ROUT and LOUT to GND Voltage

CPP to PGND Voltage

CPN to PGND Voltage

V

Maximum Junction Temperature

150

Storage Temperature Range

-65 to +150

Maximum Soldering Temperature Range, 10 Seconds

260

Power Dissipation

Internally Limited

W

Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Range

Symbol

Parameter

Min.

Max.

Unit

Supply Voltage

2.3

4.5

High Level Threshold Voltage

RSD, LSD

1

-

Low Level Threshold Voltage

RSD, LSD

-

0.35

V

Operating Ambient Temperature Range

-40

85

Operating Junction Temperature Range

-40

125

APA2175

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

-

5

10

mA

-

1

5

µA

Input current

RSD, LSD

-

0.1

-

µA

Recommended Operating Conditions

Electrical Characteristics

V

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Thermal Resistance - Junction to Ambient

(Note 2)

TQFN4x4-20B

TSSOP-16

45

100

θ

JC

Thermal Resistance - Junction to Case

(Note 3)

TQFN4x4-20B

8

Note 2: Please refer to “ Layout Recommendation”, the Thermal Pad on the bottom of the IC should soldered directly to the PCB’s

Thermal Pad area that with several thermal vias connect to the ground plan, and the PCB is a 2-layer, 5-inch square area with 2oz

copper thickness.

Note 3: The case temperature is measured at the center of the Thermal Pad on the underside of the TQFN4x4-20B package.