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ACPL-331J Datasheet(PDF) 4 Page - AVAGO TECHNOLOGIES LIMITED |
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ACPL-331J Datasheet(HTML) 4 Page - AVAGO TECHNOLOGIES LIMITED |
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4 / 23 page ![]() Solder Reflow Thermal Profile Recommended Pb-Free IR Profile Note: Non-halide flux should be used. 0 TIME (SECONDS) 200 100 50 150 100 200 250 300 0 30 SEC. 50 SEC. 30 SEC. 160 °C 140 °C 150 °C PEAK TEMP. 245 °C PEAK TEMP. 240 °C PEAK TEMP. 230 °C SOLDERING TIME 200 °C PREHEATING TIME 150 °C, 90 + 30 SEC. 2.5 °C ± 0.5 °C/SEC. 3°C + 1 °C/ - 0.5 °C TIGHT TYPICAL LOOSE ROOM TEMPERATURE PREHEATING RATE 3 °C + 1 °C/ - 0.5 ° C/SEC. REFLOW HEATING RATE 2.5 °C ± 0.5 ° C/SEC. Note: Non-halide flux should be used. 217 °C RAMP-DOWN 6 °C/SEC. MAX. RAMP-UP 3 °C/SEC.MAX. 150 - 200 °C 260 +0/-5 °C t 25 °C to PEAK 60 to 150 SEC. 20-40 SEC. TIME WITHIN 5 °C of ACTUAL PEAK TEMPERATURE tp ts PREHEAT 60 to 180 SEC. tL TL Tsmax Tsmin 25 Tp TIME NO TES: THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX. Tsmax = 200°C, Tsmin = 150°C |
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